Laird Technologies, Gap Filler




Tflex™ gap fillers are used to bridge the interface between hot components and a chassis or heat sink assembly. The combination of good thermal conductivity and softness reduces mechanical stress, but maintains thermal performance.

TFlex gap Filler Scheme
TFlex Gap Filler
Target Applications:
  • Industrial – LED lighting, power supplies, power converters, lighting ballasts, controllers
  • Aerospace and military – power supplies, microwave radio, and controllers
  • Telecom – wireless infrastructure, routers, and VOIP phones
  • IT – notebooks, servers, memory modules, hard disk drivers, solid state drives, scanners, printers
  • Consumer – gaming systems, LCD PDP televisions, and displays
  Contact us    

  Milano Uffici
  +39 02535831
  Roma Uffici
  +39-06 86 89 42 59
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